| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 8 Apr 2014 | SERC | Institute of Microelectronics | Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application | Vivek Chidambaram, Chen Bangtao, Gan Chee Lip, Daniel Rhee Min Woo | Journal of Electronic Materials |