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Publication date Communities Collections Article title Author(s) Journal/Conference
9 Jun 2015 SERC Institute of Microelectronics A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application Jaibir Sharma, Jae-Wung Lee, Srinivas Merugu, Navab Singh IEEE Transactions on Components, Packaging and Manufacturing Technology
15 May 2015 SERC Institute of Microelectronics Cavity-enhanced sacrificial layer micromachining for faster release of thin film encapsulated MEMS Jae-Wung Lee, Jaibir Sharma, Margarita Sofia Narducci, Srinivas Merugu, Xiao Lin Zhang, Singh Navab Journal of Micromechanics and Microengineering
1 Aug 2014 SERC Institute of Microelectronics Robust Pop-Up Shape Encapsulation Using Dual-Sealing Jae-Wung Lee, Jaibir Sharma, Srinivas Merugu, Navab Singh Journal of Microelectromechanical Systems
1 Oct 2013 SERC Institute of Microelectronics Nano Porous Gold as a Capping Layer for Thin Film Encapsulation Jae-Wung Lee, Wei-Shan Wang, Jaibir Sharma, Yu-Ching Lin, Navab Singh Journal of Microelectromechanical Systems