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Publication date Communities Collections Article title Author(s) Journal/Conference
9 Jun 2015 SERC Institute of Microelectronics A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application Jaibir Sharma, Jae-Wung Lee, Srinivas Merugu, Navab Singh IEEE Transactions on Components, Packaging and Manufacturing Technology
15 May 2015 SERC Institute of Microelectronics Cavity-enhanced sacrificial layer micromachining for faster release of thin film encapsulated MEMS Jae-Wung Lee, Jaibir Sharma, Margarita Sofia Narducci, Srinivas Merugu, Xiao Lin Zhang, Singh Navab Journal of Micromechanics and Microengineering
1 Aug 2014 SERC Institute of Microelectronics Robust Pop-Up Shape Encapsulation Using Dual-Sealing Jae-Wung Lee, Jaibir Sharma, Srinivas Merugu, Navab Singh Journal of Microelectromechanical Systems
28 Feb 2014 SERC Institute of Microelectronics Integration of AlN with molybdenum electrodes and sacrificial amorphous silicon release using XeF2 Jaibir Sharma, Sanchitha Fernando, Wee Ming Tan Journal of Micromechanics and Microengineering
1 Oct 2013 SERC Institute of Microelectronics Nano Porous Gold as a Capping Layer for Thin Film Encapsulation Jae-Wung Lee, Wei-Shan Wang, Jaibir Sharma, Yu-Ching Lin, Navab Singh Journal of Microelectromechanical Systems
1 Sep 2013 SERC Institute of Microelectronics Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices Jaibir Sharma, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Bangtao Chen, Vasarla Nagendra Sekhar IEEE Transactions on Components, Packaging and Manufacturing Technology