| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems | Yong Han, Boon Long Lau, Gongyue Tang, Seow Meng Low, Jason Goh | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |