| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 17 Jun 2026 | SERC | Institute of Microelectronics | StressScore: Evaluating AI Predicted Stress Contours in Advanced Packaging With Contrastive Learning (Pending publish) | Kart Leong Lim, Thanmaya Bharadwaj Puvvada | 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) |