| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 7 May 2021 | SERC | Institute of Microelectronics | Wafer to Wafer Hybrid Bonding Development by Advanced Finite Element Modelling for 3D IC Packages (Pending publish) | Ji Lin, Che Fa Xing, Ji Hong Miao, Li Hong Yu, Kawano Masaya |