| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions | King-Jien Chui, Mingbin Yu | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) | Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 23 Jun 2015 | SERC | Institute of Microelectronics | Heterogeneous 2.5D integration on through silicon interposer | Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong | Applied Physics Reviews |