| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 7 May 2021 | SERC | Institute of Microelectronics | Wafer to Wafer Hybrid Bonding Development by Advanced Finite Element Modelling for 3D IC Packages (Pending publish) | Ji Lin, Che Fa Xing, Ji Hong Miao, Li Hong Yu, Kawano Masaya | |
| 1 Feb 2013 | SERC | Institute of Microelectronics | 3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections (Pending publish) | Navas Khan, Li Hong Yu, Tan Siow Pin, Soon Wee Ho, Vaidyanathan Kripesh, Damaruganath Pinjala, John H. Lau, Toh Kok Chuan | IEEE Transactions on Components, Packaging and Manufacturing Technology |