| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Nov 2017 | SERC | Institute of Microelectronics | Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling | Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano | IEEE Transactions on Components, Packaging and Manufacturing Technology |