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Publication date Communities Collections Article title Author(s) Journal/Conference
28 Nov 2019 SERC Institute of High Performance Computing  Defect-Free Electroplating of High Aspect Ratio Through Silicon Vias: Role of Size and Aspect Ratio C. A. Joshi, H. Ramanarayan, K. H. Khoo, H. Jin, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2019 International Wafer Level Packaging Conference (IWLPC)
13 Dec 2018 SERC Institute of High Performance Computing  Multiscale Models for Electroplating of Through Silicon Vias K. H. Khoo, MingRui Lai, H. Ramanarayan, Hongmei Jin, S. Wu, C. A. Joshi, K. R. Mangipudi, J. J. Cheng, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2018 International Wafer Level Packaging Conference (IWLPC)
27 Nov 2018 SERC Institute of High Performance Computing  Analysis of Cold Spray Coating Sprayed at Angles ZHI CHENG KELVIN Loke, Junyan Guo, Zhiqian Zhang, N. Sridhar, Pak Keng Koh, TEIK CHENG ALAN Lim, HONG NING PHILIP Chean, WAI ONN RICHARD KWOK Proceedings of the Asian Thermal Spray Conference, Volume IX
27 Nov 2018 SERC Institute of High Performance Computing  Analysis of Cold Spray Coating Formed with Stationary Nozzle K. Loke, P.K. Koh, H.W. NG, P. Cheang, J. Guo, Zhiqian Zhang, N. Sridhar Proceedings of the Asian Thermal Spray Conference, Volume IX