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Publication date Communities Collections Article title Author(s) Journal/Conference
3 Sep 2019 SERC Institute for Infocomm Research Learning of Multi-Dimensional Analog Circuits Through Generative Adversarial Network (GAN) Raju Salahuddin, Rahul Dutta, Ashish James, Chemmanda John Leo, Yong-Joon Jeon, Balagopal Unnikrishnan, Foo Chuan Sheng, Zeng Zeng, Kevin Tshun Chuan Chai, Vijay Ramaseshan Chandrasekhar 2019 32nd IEEE International System-on-Chip Conference (SOCC)
2 Jun 2019 SERC Institute for Infocomm Research Semi Supervised Learning of Multi-Dimensional Analog Circuits Rahul Dutta, Salahuddin Raju, Ashish James, Bruno Lecouat, Chemmanda John Leo, Yong-Joon Jeon, Balagopal Unnikrishnan, Chuan Sheng Foo, Zeng Zeng, Kevin Tshun Chuan Chai, Vijay Chandrasekhar Design Automation Conference (DAC) (2019)
15 Feb 2016 SERC Institute of Microelectronics An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate Ka Fai Chang, Jun Zhou, Surya Bhattacharya, Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, Songbai Zhang IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong Applied Physics Reviews