| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Nov 2013 | SERC | Institute of Microelectronics | Relationship Between Wafer-Level Warpage and Cu Overburden Thickness Controlled by Isotropic Wet Etching for Through Si Vias | Steven Lee Hou Jang, Ramana Murthy, Eugene Tan Swee Kiat, Jae Woong Choi, Lee Guan Ong, Hong Yu Li, Soon Wook Kim, Gil Ho Hwang | IEEE Transactions on Components, Packaging and Manufacturing Technology |