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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jul 2018 SERC Institute of Microelectronics 100 Gbps (4 × 25 Gbps) Optical Receiver Module Packaged in Chip-on-Board Based on Germanium Photodetector Raja M. Kumarasamy, Jason Tsung Yang Liow, Do-Won Kim, Andy Eu Jin Lim, Vishal Vinayak Kulkarni, Surya Bhattacharya, Guo Qiang Lo Procedia Engineering
1 Nov 2017 SERC Institute of Microelectronics Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano IEEE Transactions on Components, Packaging and Manufacturing Technology
15 Feb 2016 SERC Institute of Microelectronics An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate Ka Fai Chang, Jun Zhou, Surya Bhattacharya, Roshan Weerasekera, Guruprasad Katti, Rahul Dutta, Songbai Zhang IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test