| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 17 Dec 2014 | SERC | Institute of Microelectronics | Characterization and Modeling of Fine-Pitch Copper Ball 4 Bonding on a Cu/Low-k Chip | Xiaowu Zhang, T. C. Chai, Fa Xing Che, L. C. Wai | Journal of Electronic Materials |