| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 May 2019 | SERC | Institute of Microelectronics | Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design | Gongyue Tang, Tai Chong Chai, Xiaowu Zhang | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 30 May 2017 | SERC | Institute of Microelectronics | Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package | Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 1 Mar 2015 | SERC | Institute of Microelectronics | Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing | Tai Chong Chai, Hsiang-Yao Hsiao, Alastair David Trigg | IEEE Transactions on Components, Packaging and Manufacturing Technology |