| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Passive Devices Fabrication on FOWLP and Characterization for RF Applications | Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 1 Sep 2013 | SERC | Institute of Microelectronics | Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration | Cheng Jin, Siong Chiew Ong, Teck Guan Lim, Ka Fai Chang, Soon Wee Ho | IEEE Transactions on Components, Packaging and Manufacturing Technology |