| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Feb 2013 | SERC | Institute of Microelectronics | 3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections (Pending publish) | Navas Khan, Li Hong Yu, Tan Siow Pin, Soon Wee Ho, Vaidyanathan Kripesh, Damaruganath Pinjala, John H. Lau, Toh Kok Chuan | IEEE Transactions on Components, Packaging and Manufacturing Technology |