| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 7 Apr 2015 | SERC | Institute of Microelectronics | High-throughput multiple dies-to-wafer bonding technology and III/V-on-Si hybrid lasers for heterogeneous integration of optoelectronic integrated circuits | Song Junfeng, Cheng Yuanbing, Luo; Xianshu, Cao Yulian, Hu Xiaonan, Liu Chongyang, Liow Tsung-Yang, Yu Mingbin, Wang Hong, Guo-Qiang Patrick, Li Chengming, Wang Qi Jie | Frontiers in Materials |
| 18 Mar 2014 | SERC | Data Storage Institute | Recording Performance and Comparison of Graded- {T_{c}} and - {K_{u}} HAMR Systems | Eason K, Wang Hong Tao, Elidrissi M.R, Xu Baoxi, Yuan Zhimin, Chan Kheong Sann | Magnetics, IEEE Transactions on (Volume:50 , Issue: 3 ) |