| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) | Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |