| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 3 Feb 2017 | SERC | Institute of Microelectronics | High-Density 3D-Boron Nitride and 3D Graphene for High-Performance Nano-Thermal Interface Material | Manuela Loeblein, Siu Hon Tsang, Matthieu Pawlik, Eric Jian Rong Phua, Han Yong, Xiao Wu Zhang, Chee Lip Gan, Edwin Hang Tong Teo | ACS Nano |
| 31 Mar 2014 | SERC | Institute of Microelectronics | Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers | Heng Yun Zhang, Xiao Wu Zhang, B. L. Lau, Sharon Lim, Liang Ding, M. B. Yu | IEEE Transactions on Components, Packaging and Manufacturing Technology |