| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 9 Jun 2015 | SERC | Institute of Microelectronics | Heat Dissipation Capability of a Package-On-Package Embedded Wafer-Level Package | Yong Han, Boon Long Lau, Yang Jung, Xiaowu Zhang | Design & Test, IEEE |