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Publication date Communities Collections Article title Author(s) Journal/Conference
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
11 Jun 2018 SERC Institute of Materials Research and Engineering Tailoring Porosity in Copper-Based Multinary Sulfide Nanostructures for Energy, Biomedical, Catalytic, and Sensing Applications Michelle D. Regulacio, Yong Wang, Zhi Wei Seh, Ming-Yong Han ACS Applied Nano Materials
1 Nov 2017 SERC Institute of Microelectronics Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017 SERC Institute of Microelectronics Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems Yong Han, Boon Long Lau, Gongyue Tang, Seow Meng Low, Jason Goh 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Jan 2016 SERC Institute of Microelectronics Design Optimization and Characterization of Silicon Microcooler System through Finite Element Modeling and Experimental Analyses Fa Xing Che, Yong Han, Boon Long Lau, Xiaowu Zhang IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
18 Dec 2015 SERC Institute of Materials Research and Engineering Silk Fibroin for Flexible Electronic Devices Bowen Zhu, Hong Wang, Wan Ru Leow, Yurong Cai, Xian Jun Loh, Ming-Yong Han, Xiaodong Chen Advanced Materials
8 Dec 2015 SERC Institute of Microelectronics Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang Components, Packaging and Manufacturing Technology, IEEE Transactions on
9 Jun 2015 SERC Institute of Microelectronics Heat Dissipation Capability of a Package-On-Package Embedded Wafer-Level Package Yong Han, Boon Long Lau, Yang Jung, Xiaowu Zhang Design & Test, IEEE