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26 Feb 2020 SERC Institute of High Performance Computing  First-principles study of coadsorption of Cu2+ and Cl- ions on the Cu (110) surface Khoong Hong Khoo, Bharathi Madurai Srinivasan, Ramanarayan Hariharaputran, Chaitanya Amol Joshi, David Tai-Yen Wu, Hongmei Jin RSC Advances
28 Nov 2019 SERC Institute of High Performance Computing  Defect-Free Electroplating of High Aspect Ratio Through Silicon Vias: Role of Size and Aspect Ratio C. A. Joshi, H. Ramanarayan, K. H. Khoo, H. Jin, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2019 International Wafer Level Packaging Conference (IWLPC)
13 Dec 2018 SERC Institute of High Performance Computing  Multiscale Models for Electroplating of Through Silicon Vias K. H. Khoo, MingRui Lai, H. Ramanarayan, Hongmei Jin, S. Wu, C. A. Joshi, K. R. Mangipudi, J. J. Cheng, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi 2018 International Wafer Level Packaging Conference (IWLPC)