| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2020 | SERC | Institute of Materials Research and Engineering | Electrodeposited Copper Micropillar Surfaces with Pulse Reverse Voltammetry for Enhanced Heat Dissipation | Jayce J. W. Cheng, Fengxia Wei, Sing Yang Chiam | ACS Applied Electronic Materials |
| 28 Nov 2019 | SERC | Institute of High Performance Computing | Defect-Free Electroplating of High Aspect Ratio Through Silicon Vias: Role of Size and Aspect Ratio | C. A. Joshi, H. Ramanarayan, K. H. Khoo, H. Jin, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi | 2019 International Wafer Level Packaging Conference (IWLPC) |