| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 28 Nov 2019 | SERC | Institute of High Performance Computing | Defect-Free Electroplating of High Aspect Ratio Through Silicon Vias: Role of Size and Aspect Ratio | C. A. Joshi, H. Ramanarayan, K. H. Khoo, H. Jin, S. S. Quek, D. T. Wu, N. Sridhar, M. S. Bharathi | 2019 International Wafer Level Packaging Conference (IWLPC) |
| 31 Aug 2019 | SERC | Advanced Remanufacturing and Technology Centre | Mechanical stress relaxation of a laser peened and shot peened Ni based superalloy | Chin Kai Siang, Sridhar Idapalapati, Anna Paradowska, Mark Reid, Shashwat Shukla, Dennise Tanoko Ardi | International Conference on Advanced Surface Enhancement (INCASE2019) |