| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2020 | SERC | Institute of Materials Research and Engineering | Electrodeposited Copper Micropillar Surfaces with Pulse Reverse Voltammetry for Enhanced Heat Dissipation | Jayce J. W. Cheng, Fengxia Wei, Sing Yang Chiam | ACS Applied Electronic Materials |
| 1 May 2019 | SERC | Institute of Microelectronics | Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design | Gongyue Tang, Tai Chong Chai, Xiaowu Zhang | IEEE Transactions on Components, Packaging and Manufacturing Technology |