Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

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Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems
Title:
Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems
Journal Title:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Publication Date:
30 May 2017
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Abstract:
The Si micro-fluid cooler, combining micro jet array impingement, micro-channel flow and micro-trench drainage, has been designed and experimentally evaluated. Enhanced jet array impingement has been achieved by eliminating the negative cross-flow effect among adjacent nozzles. Low thermal resistance
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(c) 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
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