| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 1 Sep 2015 | SERC | Institute of Microelectronics | Stress Analysis and Design Optimization for Low-k Chip With Cu Pillar Interconnection | Lin Jong-Kai, Au Keng Yuen, Hsiao Hsiang-Yao, Zhang Xiaowu, Che Fa Xing | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |
| 13 May 2015 | SERC | Institute of Microelectronics | Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps | Bu Lin, Ho Siowling, S.D. Velez, Long Lau Boon, Jung Booyang, Chai Taichong, Zhang Xiaowu | Components, Packaging and Manufacturing Technology, IEEE Transactions on |
| 1 May 2015 | SERC | Institute of Microelectronics | Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices | Yong Han, Lau Boon Long, Zhang Xiaowu | IEEE Electron Device Letters |